Future Chips 2017

Smart Chips, Smart World

December 18-20, 2017 at Beijing, China

Welcome to Future Chips 2017

We are pleased to announce that the second Future Chips forum will be held on December 18-20, 2017 at Beijing, China, with its key theme on “Smart Chips, Smart World”. Future Chips serve as a highly selective and premier international forum on chip design research. In addition to the invited talks, this year the forum will include panels and demonstrations. The organizing committee is excited to invite you to participate in Future Chips 2017, to discuss the frontier issues in today's chip design, as well as its application in artificial intelligence together.

Venue

The forum will be held in Tsinghua University.

Memorial Gate of Tsinghua University

Main Building of Tsinghua University

Forum Organizers

Co-Chairs

Committee

Organization

Beijing Innovation Center for Future Chip

Institute of Microelectronics, Tsinghua University

Sponsorship

Gold Sponsor


Synopsys, Inc.


Silver Sponsor


Cadence, Inc.


Technical Sponsor


中国电子学会电子设计自动化专委会